http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180125684-A

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filingDate 2017-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85592090ca99201e4fa9246587b853a3
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publicationDate 2018-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20180125684-A
titleOfInvention Semiconductor device and semiconductor device package
abstract The embodiment relates to a semiconductor element, a method of manufacturing a semiconductor element, and a semiconductor element package. A semiconductor device according to an embodiment includes a light emitting structure, a first electrode electrically connected to the first conductive semiconductor layer of the light emitting structure, a second electrode electrically connected to the second conductive semiconductor layer of the light emitting structure, A second bonding pad electrically connected to the second electrode, a first reflective layer disposed between the light emitting structure and the first bonding pad, a second reflective layer disposed between the light emitting structure and the second bonding pad, And an ohmic contact layer disposed between the upper surface of the structure and the first reflective layer to provide a first contact hole and the upper surface of the light emitting structure and the lower surface of the first reflective layer may be in contact through the first contact hole.
priorityDate 2017-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 31.