| abstract |
The present invention relates to an electronic circuit formation substrate or a semiconductor circuit formation substrate which can bond an electronic circuit formation substrate or a semiconductor circuit formation substrate to a support substrate and is excellent in heat resistance when an electronic circuit formation substrate or a semiconductor circuit formation substrate having a thickness of 1 [ A resin composition which can be peeled off under mild conditions at room temperature without changing the adhesive force even through a manufacturing process of an electronic part or a semiconductor device, an adhesive using the same, a resin layer, a laminated film and a wafer processed body, A method of manufacturing a component or a semiconductor device is provided. The present invention is a resin composition containing at least (a) a polyimide resin having a specific structure, and (b) a crosslinking agent containing a fluorene group. |