abstract |
The present invention relates to a method of manufacturing a substrate assembly (10; 10 '; 10 ") for attachment to an electronic component (30; 30' - providing a substrate (11) having a first side (12) and a second side (13) - applying a contact material layer (15) to the first side (12) of the substrate (11) - applying a prefixing agent (18) to at least part of the side (16) of the contact material layer (15) in a direction away from the substrate (11). |