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filingDate 2017-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20180030384-A
titleOfInvention Method of manufacturing semiconductor device, substrate processing apparatus, and program
abstract Plane film thickness distribution of the film formed on the substrate is controlled. A step of supplying a raw material from a first nozzle to a substrate and discharging the raw material from an exhaust port; a step of supplying a first reactant to a substrate from a second nozzle arranged farther from the exhaust port than the first nozzle, A step of forming a film on a substrate by performing a predetermined number of cycles of performing a process of supplying a second reactant from a third nozzle disposed closer to the exhaust port than the second nozzle with respect to the substrate and discharging the exhaust from the exhaust port, By controlling the balance between the flow rate of the inert gas supplied from the second nozzle, the flow rate of the inert gas supplied from the third nozzle, and the flow rate of the inert gas supplied from the first nozzle at the time of supplying the raw material, In-plane film thickness distribution of the film to be processed.
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