| abstract |
There is provided a multilayer substrate in which a semiconductor substrate having a through electrode is stacked, and which has excellent conduction characteristics and can be manufactured at a low cost. When viewed from a plane of the multi-layer substrate, conductive particles are selectively present at positions where the through electrodes face each other. The multilayer substrate has a connection structure in which opposing through electrodes are connected by conductive particles, and semiconductor substrates on which the through electrodes are formed are bonded to each other by an insulating adhesive. |