| abstract |
According to an aspect of the present invention, there is provided a semiconductor package comprising: a semiconductor substrate; an electrode pad formed on the semiconductor substrate, the electrode pad including a central portion and a peripheral portion and having a first pattern at a peripheral portion; A seed layer formed on the seed layer and formed on the electrode pad and the passivation film and having a third pattern on the second pattern, And an undercut is formed around the third pattern under the edge of the lower portion of the bump. |