| abstract |
The composition preferably comprises filler material and siloxane material comprising particles having a particle size of less than 100 microns. The siloxane material may comprise a repeating backbone of [-Si-O-Si-O] n, preferably having an alkyl or aryl group therein, and b) as well as functional crosslinking groups therein. The composition also has a filler material comprising particles that can be metal, semi-metal or ceramic particles. The composition may also include coupling agents, catalysts, antioxidants, and the like. The composition may be used, for example, in adhesives, encapsulants, solder or other layers of semiconductor packages or in a variety of other similar fields. |