| abstract |
It can be used for substrates and packages of optical elements such as light-emitting diodes and electrical elements, can withstand lead-free reflow, can be accurately molded without sinks, and is yellowed or deteriorated by light or heat. Therefore, it is possible to provide a hard and durable silicone resin substrate that can be subjected to surface processing such as plating. A silicone resin base material 1 is molded by containing a binder 2 made of a silicone resin that is three-dimensionally crosslinked and a filler 3 such as alumina powder. [Selection] Figure 1 |