| abstract |
The present invention relates to a resin composition which has a very low residual stress of a cured product and is excellent in adhesion to a metal substrate such as Pt, LT and Ta after a heat and humidity test, and / or a laminate thereof, And to provide the cured product. The present invention provides a photosensitive resin composition comprising (A) an epoxy resin, (B) a compound having a phenolic hydroxyl group, and (C) a photocathione polymerization initiator, wherein the weight average epoxy equivalent of the epoxy resin (A) eq. (A) 20% by mass or more of the epoxy resin satisfies the following formula (1) And an epoxy equivalent of 500 to 4500 g / eq. , And the compound (B) having a phenolic hydroxyl group is a photosensitive resin composition containing a phenol compound having a specific structure. |