| abstract |
The present invention relates to a composition comprising 1.2 to 40 wt% tin ions; 0.01 to 2.0 wt% of silver ions; Conducting salt 1.0 ~ 40wt%; 0.01 to 8.0% by weight of a urea compound selected from the group consisting of trimethylthiourea, N, N'-diisopropylthiourea, acetylthiourea, ethylenethiourea, 1,3-diphenylthiourea, thiourea dioxide, ; 0.01 to 15 wt% of an antioxidant; 0.3 to 1.0 wt% of a crystal grain size adjusting agent, 0.6 to 1.5 wt% of a smoothing agent, and the remaining ultrapure water. The tin-silver solder bump plating solution according to the present invention has a stable plating rate and an alloy composition according to the current density while forming a tin-silver solder bump having a low plating temperature stability and a bump shape and a low process temperature, There is an advantage that it can be formed. |