| abstract |
The present invention provides a tin alloy electroplating composition that is substantially free of lead and cyanide compounds, has good mechanical properties, and is easily solderable. The electrolyte composition is selected from tin ions, ions of one or more alloying metals, acids, thiourea derivatives, and alkanolamines, polyethyleneimines, alkoxylated aromatic alcohols, and combinations thereof. Additives. Similarly, methods of depositing a tin alloy on a substrate and forming interconnect bumps on a semiconductor device are disclosed. [Selection diagram] None |