http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160091326-A

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filingDate 2014-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c095d952dd535e7f216f55c0a79c23b4
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publicationDate 2016-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20160091326-A
titleOfInvention Silicon nitride film, production method therefor, and production device therefor
abstract It is possible to reduce the ratio of carbon atoms and / or hydrogen atoms to silicon atoms and nitrogen atoms in the silicon nitride film formed by the plasma CVD method using organosilane as a raw material and to improve the quality of films such as electrical characteristics It provides a possible way. One silicon nitride film of the present invention is formed by plasma CVD and by plasma-forming at least one additive gas selected from the group of hydrogen and ammonia together with the organosilane. The carbon atom content ratio when the sum of the silicon atom content and the nitrogen atom content in the silicon nitride film is 1 is less than 0.8. When the sum of the silicon atom content and the nitrogen atom content in the silicon nitride film is 1, the hydrogen atom content ratio is less than 0.9. According to the silicon nitride film, the characteristics such as the reduction of the leakage current are improved, so that the reliability of various devices including the silicon nitride film can be improved.
priorityDate 2013-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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