| abstract |
(PROBLEM TO BE SOLVED) To provide an adhesive sheet for semiconductor bonding which is capable of embedding a protruding electrode such as a bump electrode, as a result of which the back side grindability is excellent. [MEANS FOR SOLVING PROBLEMS] An adhesive sheet for semiconductor bonding according to the present invention comprises a substrate, a concavo-convex absorbing layer, a pressure-sensitive adhesive layer, and an adhesive layer laminated in this order, wherein the pressure- And the adhesive layer is formed so as to be peelable on the pressure-sensitive adhesive layer. |