http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160044004-A

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filingDate 2014-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0680cbd6529ed20f88e1984ec07accca
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publicationDate 2016-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20160044004-A
titleOfInvention Tungsten deposition with tungsten hexafluoride(wf6) etchback
abstract The implementations described herein generally relate to methods for forming tungsten materials on substrates using vapor deposition processes. The method includes the steps of placing a substrate in which a feature is formed in a substrate processing chamber, introducing a continuous flow of a tungsten halide compound and a hydrogen containing gas into the processing chamber to deposit a first tungsten film over the feature, Layer of the bulk tungsten layer using a plasma treatment to remove a portion of the first film by exposing the first film to a continuous flow of activated processing gas and a tungsten halide compound, Depositing a second film of a bulk tungsten layer by introducing a continuous flow of a tungsten halide compound and a hydrogen containing gas into the processing chamber to deposit a second tungsten film over the first tungsten film do.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200000477-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11469113-B2
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