| abstract |
A method for manufacturing low density polishing pads and low density polishing pads is described. In one example, the polishing pad for polishing the substrate has a density of less than 0.5 g / cc and includes a polishing body 222 comprised of a thermosetting polyurethane material 220. A plurality of closed cell pores (214, 218) are dispersed in the thermosetting polyurethane material (220). |