A sheet-like resin composition for use in interfacial sealing between an adherend and a semiconductor element connected to a flip chip on an adherend, wherein the weight reduction rate when the temperature is raised from 25 DEG C to 300 DEG C at a rate of temperature increase of 10 DEG C / , An organic acid having a moisture absorptivity of not more than 1% by Karl Fischer's method and an acid dissociation constant in the range of not less than 3.0 and not more than 5.0 in an amount of not less than 1% by weight and not more than 10% by weight Within the above-mentioned ranges.