abstract |
The present invention relates to an alkali-insoluble or poorly soluble polymeric compound having an acid functional group protected by an acid labile group and a polyacrylic acid ester or polymethacrylic acid ester polymer having a weight average molecular weight of 1,000 to 500,000 in terms of polystyrene The present invention relates to a chemically amplified positive resist material and a pattern forming method, which are characterized by containing a polymer material. According to the present invention, in the case of forming a pattern having a thickness of 5 to 100 mu m thick applied on a substrate, the dropout (solubility) of the bottom of the pattern and the vicinity of the substrate are excellent, To 100 mu m, it is possible to provide a chemically amplified positive resist material characterized in that the development time can be shortened. |