http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150129927-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a78c0875e739556c0d7e09429bef595a |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F291-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-68 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2014-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b8a6025720518e4c2765e9a07f9e0df http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd6190f8a8c0fff40714e36777562a63 |
| publicationDate | 2015-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20150129927-A |
| titleOfInvention | Modified epoxy resin curable by heat or photo, manufacturing method thereof and composition for solder resist of flexible substrate |
| abstract | The present invention provides a modified epoxy resin and a composition for a solder resist containing the modified epoxy resin, which are prepared under predetermined conditions and process conditions. The modified epoxy resin according to the present invention can be used as a main component of a composition for a thermosetting solder resist or a composition for a photo-curable solder resist since the modified epoxy resin according to the present invention has a thermosetting property or a photo-setting property. The composition for a solder resist containing a modified epoxy resin according to the present invention is excellent in the hardness, the adhesive strength, the solvent resistance, the alkali resistance, the acid resistance, the soldering heat resistance, the bending resistance and the bendability And can be printed in a fine pattern on a flexible printed circuit board, so that it is useful for small-sized, high-density and thin flexible electronic products. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022075453-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180032474-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200082481-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017200271-A3 |
| priorityDate | 2014-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 255.