http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080029341-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7c1762eac0a0b717b3186e45cc0ded7e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F20-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-50 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-10 |
| filingDate | 2006-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3d91c2679752b22ed12eb8b457dffd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f0edb945b5c2e30a80cb81db70580ae |
| publicationDate | 2008-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20080029341-A |
| titleOfInvention | Acid-modified epoxy (meth) acrylate compound and photosensitive thermosetting resin composition containing the compound and its cured product |
| abstract | Liquid solder resist used in the manufacture of printed wiring boards, especially IC packages such as BGAs (ball grid arrays) and CSPs (chip scale packages) using printed resistive printed wiring boards and encapsulating resins In the field of electronic materials of inks and dry film resistors, in the cold heat cycle test, which is one of the mounting and long-term reliability tests, cracks do not occur in the cured film, and the dryness, alkali developability, development life, and PCT are not cracked. The acid-modified epoxy (meth) acrylate compound and the acid-modified epoxy (meth) acrylate compound suitable for forming a film excellent in resistance, solder heat resistance, adhesion to substrates, hardness, electroless gold plating resistance and electroless tin plating resistance, It provides the photosensitive thermosetting resin composition containing.n n n Epoxy compound which has two epoxy groups in 1 molecule to the unsaturated group containing dicarboxylic acid compound obtained by making the acid anhydride (ai) of a tribasic acid and / or tetrabasic acid, and unsaturated group containing monoalcohol (a-ii) react. Reaction obtained by making the unsaturated group containing epoxy compound (a) which has two epoxy groups, and unsaturated group containing monocarboxylic acid (b) react in 1 molecule represented by following General formula (1) obtained by making (a-iii) react. Furthermore, the acid-modified epoxy (meth) acrylate compound (I) obtained by making a polybasic acid anhydride (c) react with a product, the epoxy compound (II) which has 2 or more epoxy groups in 1 molecule, a photoinitiator (III), a diluent The said subject can be achieved by the alkali developable photosensitive thermosetting resin composition containing (IV) as an essential component.n n n General formula (1)n n n (Formula 1)n n n n n n n n (Wherein M is a hydrogen atom orn n n (Formula 2)n n n n n n n n Wherein at least one of Mn n n (Formula 3)n n n n n n n n X is a divalent aromatic and / or alkyl group and / or a cyclohexyl group, Y is a trivalent and / or tetravalent aromatic group, A is a residue of an unsaturated group-containing monoalcohol, and n is 1 to 100.) |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150129927-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8334092-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102792224-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101293062-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011111964-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011111964-A3 |
| priorityDate | 2006-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 141.