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filingDate 2014-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95eecc2cfe61b77a7e0ea9625c025988
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publicationDate 2015-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20150082806-A
titleOfInvention Light emitting Device package
abstract The light emitting device package of the embodiment includes a header and a light emitting element disposed in a cavity on the header, the light emitting element including a substrate, a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer disposed under the substrate, A first metal pad and a second metal pad disposed between the first metal pad and the first conductive type semiconductor layer; and a second metal pad disposed between the first metal pad and the first conductive type semiconductor layer, Wherein the first conductivity type semiconductor layer includes a first region formed so as to surround four sides of the active region in which the second conductivity type semiconductor layer is disposed in a plane, And at least one second region having a shape surrounded by the active region and having a first bump disposed therein.
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