Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
filingDate |
2013-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2015-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20150033324-A |
titleOfInvention |
Preparation method for dry film solder resist and film laminate used therein |
abstract |
The present invention relates to a dry film solder resist production method capable of forming a dry film solder resist having fine irregularities on its surface by a simpler method and a film laminate used therefor. The method for producing a dry film solder resist includes the steps of: forming a resin composition having a predetermined photo-curable property and a thermosetting property on a transparent carrier film having fine irregularities having an average roughness (Ra) of 200 nm to 2 탆 formed on its surface; Laminating the resin composition on a substrate to form a laminate structure in which a substrate, a resin composition and a transparent carrier film are sequentially formed; Exposing the resin composition to light, and peeling the transparent carrier film; And a step of alkali-developing the resin composition of the non-exposed portion and thermally curing the resin composition. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022145764-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11353791-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200003616-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-200490675-Y1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200000835-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200000834-A |
priorityDate |
2013-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |