| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0f7012275f56834dbe07c6e3d0654dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
| filingDate |
2014-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b54532f3a3f868c0e2ae5bfe4f72aef7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f50d6e7cd4e6a83a9f4b0ba66565cc4 |
| publicationDate |
2015-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20150002506-A |
| titleOfInvention |
Wiring substrate and method of manufacturing the same |
| abstract |
A plurality of strip-shaped wiring conductors 6 each having a semiconductor element connection pad 7 to which an electrode terminal T of a semiconductor element S is connected are formed on an outermost insulating layer 1b, The semiconductor element connection pads 7 are individually exposed on the insulating layer 1b on the outermost layer and on the strip-shaped wiring conductors 6, And the solder resist layer 3a having the opening 9 is adhered to the solder resist layer 3a so that the solder resist layer 3a contains the insulating filler F therein, And is set down below the upper surface of the wiring conductor 6. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10935863-B2 |
| priorityDate |
2013-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |