http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120109614-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0269 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-095 |
| filingDate | 2011-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_debab755bbe7671f2fbe7142d1934cbe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_810d05d43df07db512a5aa62cbd2fd53 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f39641f2b55f9083c199105f786d54c |
| publicationDate | 2012-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20120109614-A |
| titleOfInvention | Laminated structure and the photosensitive dry film used for this |
| abstract | In the laminated structure which has at least the board | substrate 1 and the photosensitive resin layer or hardened film layer 2 containing the inorganic filler 3 formed on the said board | substrate, as long as possible the linear thermal expansion coefficient as a whole photosensitive resin layer or hardened film layer, In order to keep it low and not to reduce resolution, and to have excellent adhesiveness with an underfill resin part and a mold resin part, the content rate of the inorganic filler in the said photosensitive resin layer or hardened film layer differs from the surface layer part from which the said board | substrate differs from the said board | substrate. It is lower than the part. In a preferred embodiment, the photosensitive resin layer or the cured coating layer includes at least two layers having different content ratios of the inorganic filler, and the content ratio of the inorganic filler in the photosensitive resin layer or the cured coating layer on the surface side far from the substrate is in the other layer. It is lower than the content rate of an inorganic filler. The photosensitive dry film which has the said photosensitive resin layer is used suitably as a soldering resist or an interlayer resin insulating layer of a printed wiring board. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150002506-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170069260-A |
| priorityDate | 2010-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 552.