| abstract |
Embodiments of the present invention relate to a system comprising a plurality of dies in a three-dimensional (3D) integrated integrated circuit (IC) package assembly, as well as corresponding manufacturing methods, and such 3D IC package assemblies. A bumpless build-up layer (BBUL) package substrate may be formed on a first die such as a microprocessor die. A laser beam can be used to form an opening in the die backside film (DBF) to expose the TSV pad on the backside of the first die. A second die, such as a memory die stack, may be connected to the first die by die interconnections formed between corresponding TSVs of the first and second die. The underfill material can be applied and / or the capsule fire can be applied over the second die and / or the package substrate to fill some or all of any residual gaps between the first and second dies. Other embodiments may be described and / or claimed. |