| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_62f941494409aea84f621977c5f0ab81 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0154 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00261
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0018
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00333 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate |
2012-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83f7173609089338900bc1ab68c4a23a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_846d76a28478ac52d7957d28959193d7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed3c2a9d20cd82e52d544881ce8b9c31 |
| publicationDate |
2014-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140126696-A |
| titleOfInvention |
Packaging compatible wafer level capping of mems devices |
| abstract |
In the case of a wafer, the moving part of the MEMS device is encapsulated and protected so that the product, the lead-frame packaging, can be used. An overcoat polymer such as epoxycyclohexyl polyhedral oligomeric silsesquioxane (EPOSS) was used as a masking material to overcoat the air-cavity as well as to pattern the sacrificial polymer. The resulting air-cavity is clean, debris-free and hard. The cavity has a substantial strength that can withstand the molding pressure during lead-frame packaging of the MEMS device. A wide cavity of 20 pm x 400 pm to 300 pm x 400 um was produced and found to be mechanically stable. They can potentially accommodate MEMS devices in a wide range of sizes. The strength of the cavity was investigated using nano-indentations and modeled using analytical and finite element techniques. Packaged capacitive resonators using this protocol showed clean sensing electrodes and excellent functionality. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11527418-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10784123-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10269587-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10547285-B2 |
| priorityDate |
2011-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |