http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140119835-A

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publicationDate 2014-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20140119835-A
titleOfInvention Sputtering target, method for manufacturing sputtering target, and method for forming thin film
abstract The transistor formed using the oxide semiconductor has a lower reliability than the transistor formed using the amorphous silicon. Therefore, in the present invention, a semiconductor device including a highly reliable transistor formed using an oxide semiconductor is manufactured. The oxide semiconductor film is deposited by a sputtering method using a sputtering target including an oxide semiconductor in which the c-axis direction of the crystal has a degree of crystallinity parallel to the normal vector of the upper surface of the oxide semiconductor. The target is formed by mixing the raw materials so that the composition ratio can be obtained.
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