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publicationDate 2014-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20140063618-A
titleOfInvention Heat dissipation parts for semiconductor devices
abstract And a coating layer made of a metal or an aluminum-ceramic composite material containing aluminum as a main component on both surfaces of a plate having a thickness of 0.4 to 6 mm, the balance being made of a metal containing aluminum as a main component and containing 40 to 70 volume% (1) an amorphous Ni alloy layer having a film thickness of 0.1 to 1 占 퐉, (2) an amorphous Ni alloy layer having a film thickness of 1 to 5 占 퐉 (3) an Au layer having a film thickness of 0.05 to 4 탆 is formed, wherein the ratio of the Ni alloy layer to the Ni layer (Ni alloy layer thickness / Ni layer thickness) is 0.3 or less, / RTI &gt;
priorityDate 2011-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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