| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate |
2012-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77f020928482599616d8caf16ecd4e94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da1ac94bd4b2a0f0956ed03d835a39ac |
| publicationDate |
2013-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20130035951-A |
| titleOfInvention |
Photosensitive resin composition, its cured film, and printed wiring board |
| abstract |
This invention provides the photosensitive resin composition which has favorable touch drying property, and is high in electroless gold plating tolerance, its cured film, and the printed wiring board provided with the said cured film. This invention is a photosensitive resin composition containing (A) acid-modified photosensitive epoxy resin, (B) non-photosensitive carboxylic acid resin, and (C) liquid bifunctional epoxy resin. It is preferable that the weight average molecular weights of said (B) nonphotosensitive carboxylic acid resin are 10000 or more and 30000 or less. |
| priorityDate |
2011-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |