| abstract |
(57) To provide a conductive composition for forming a fine conductive circuit pattern capable of ensuring conductivity and adhesion without firing and a method for forming the conductive circuit. The basic aspects of the photocurable thermosetting conductive composition of the present invention are as follows: (A) conductive powder, (B) organic binder, (C) photopolymerizable monomer, (D) photopolymerization initiation. Agent, (E) A composition containing a thermosetting resin and (F) a solvent, wherein the conductive powder as the component (A) is blended in the composition excluding the solvent in a proportion of 70 to 90% by mass. Yes. According to such a photocurable thermosetting conductive composition, a pattern of a coating film is formed by exposure and development, and then 80 ° C to 300 ° C. By thermosetting at 0 ° C., a fine conductive circuit having both excellent conductivity and adhesion can be easily formed without going through complicated steps. |