http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130035202-A

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filingDate 2012-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbf86f0d9664122e2584186254afa3bb
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publicationDate 2013-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20130035202-A
titleOfInvention Substrate processing apparatus and substrate processing method
abstract In the substrate processing apparatus 1, the specific resistance of the antistatic solution becomes the target specific resistance by controlling the amount of carbon dioxide dissolved in pure water by the carbon dioxide dissolving unit 62. Subsequently, the antistatic liquid having a higher specific resistance than the SPM liquid is supplied to the substrate 9 by the antistatic liquid supply part 6, and the entire upper surface 91 of the substrate 9 is embedded in the antistatic liquid, thereby providing the substrate 9. ) Is charged relatively slowly. After the end of the antistatic treatment, the SPM liquid is supplied onto the substrate 9 by the processing liquid supply unit 3 to perform the SPM process. This prevents the rapid movement of a large amount of charge from the substrate 9 to the SPM liquid during the SPM process, thereby preventing damage to the substrate 9. In addition, by maintaining the specific resistance of the antistatic liquid at the target specific resistance, the static elimination efficiency of the substrate 9 can be improved and the time required for the antistatic treatment can be shortened in a range where the damage of the substrate 9 does not occur.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10464107-B2
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