| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2852
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-1804
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2891
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0016 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J167-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J167-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2011-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2012-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20120133985-A |
| titleOfInvention |
Adhesive Sheet for Semiconductor Wafer Processing |
| abstract |
It is excellent in storage stability under various environments, and it is possible to prevent contamination of the adherend even after use, and also has excellent trackability to the step formed by the circuit pattern when bonded to the circuit pattern formation surface of the semiconductor wafer. An object of the present invention is to provide a pressure sensitive adhesive sheet for semiconductor wafer processing that is excellent in lifting amount stability over time. A pressure-sensitive adhesive layer is provided on at least one side of the substrate, and the pressure-sensitive adhesive layer has a polyester plasticizer and a surfactant added to the base polymer, and the solubility parameter (SP value) of the plasticizer and the surfactant is 0.9 ≦ [SP of plasticizer. Value] / [SP value of surfactant] ≤ 1.0, which is a pressure sensitive adhesive sheet for semiconductor wafer processing. |
| priorityDate |
2010-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |