http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120109130-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d4e883eff4abad173c66a78da100b41f
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2642
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
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filingDate 2011-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f1ef4bcb78ae512ea63af56a961eebc
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_650f4201ca5e06eb99c4af0529734f9e
publicationDate 2012-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20120109130-A
titleOfInvention Printed Circuit Board Jig for Light Emitting Diode Package Environmental Test
abstract The present invention facilitates the maintenance of the operating state through the power supply terminal during light quantity measurement, environmental test, and life test, and properly maintains the heating state of the heat-sensitive surface mount LED package. This is to ensure reliability. The printed circuit board jig for the light emitting diode package environmental test of the present invention is less than 1W FR-4 printed circuit board; 1 to 3W is an aluminum metal printed circuit board; The printed circuit board is a printed circuit board having the same size; The printed circuit board includes a printed circuit board having electrical power connection portions of the same size; The printed circuit board may include a printed circuit board coated with a white ink for a substrate; The metal printed circuit board includes a printed circuit board having an aluminum heat dissipation unit for heat dissipation.
priorityDate 2011-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
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http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268

Total number of triples: 24.