abstract |
An object of the present invention is to provide a resist composition having an excellent exposure margin and mask error factor, and capable of obtaining a resist pattern with less occurrence of defects. The resist composition of the present invention is a resin having a structural unit represented by the formula (I), an insoluble or poorly soluble in an aqueous alkali solution, a resin, an acid generator, a formula (II1) or It contains the compound represented by general formula (II2). [Wherein, R 1 is a hydrogen atom or a methyl group; A 1 is an alkanediyl group; R 2 is a fluorine atom-containing hydrocarbon group; R 6 represents an alkyl group, an alicyclic hydrocarbon group or an aromatic hydrocarbon group, and these groups may have a substituent; X 1 is a single bond or an alkanediyl group; X 2 is —O— or —N (R d ) —, and R d is a hydrogen atom or an alkyl group; R 3 , R 4 and R 5 each represent a hydrogen atom, an alkyl group or an aromatic hydrocarbon group] |