| abstract |
A water-soluble resin composition comprising a water-soluble polymer represented by the following formula (1) and a first water-soluble solvent and applied and heat-treated on a photoresist film having a contact hole pattern formed thereon is disclosed to reduce the size of the contact hole. [Formula 1] In Formula (1), each of R 1 , R 2 , R 3, and R 5 is independently hydrogen, ether group, ester group, carbonyl group, acetal group, C group including epoxy group, nitrile group, amine group, or aldehyde group 1-30 alkyl group or C 3-30 cycloalkyl group, wherein R 4 , R 6 , R 7 and R 8 are each independently hydrogen or methyl, n is an integer of 0 to 5, and a is 0.05 Is a real number ranging from 0.5 to 0.5, and b, c, and d are real numbers ranging from 0 to 0.7, respectively, and a, b, c, and d satisfy a condition of a + b + c + d = 1. |