http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110095908-A

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filingDate 2009-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50971cc3ca5b884ba6e7432ceb251655
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publicationDate 2011-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20110095908-A
titleOfInvention Preprocess Plasma Interposed Ashing Process and Apparatus
abstract A preprocess of the plasma interposed ashing process for removing organic material from the substrate includes exposing the substrate to a plasma to selectively remove photoresist, implanted photoresist, polymer and / or residue from the substrate, wherein The plasma has a ratio of active nitrogen to active oxygen in the plasma that is greater than the ratio of active nitrogen to active oxygen obtained from the plasma formed in the gas mixture comprising oxygen gas and nitrogen gas. Plasma exhibits high throughput while minimizing and / or preventing substrate oxidation and dopant bleaching. Plasma apparatus is also disclosed.
priorityDate 2008-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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