| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f7fb8e9adad52abb74b28b5975feb57a |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2011-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8aa760fa945ae6da85d6dbcec0e866e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4eef7301a6b215c746b5d0c89238fb8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1a368b6c4216dee3d93578a318b8254 |
| publicationDate |
2011-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20110094253-A |
| titleOfInvention |
Method for Chemical Mechanical Planarization of Tungsten-Containing Substrates |
| abstract |
The method described herein provides a low level of dishing in the polished substrate while simultaneously providing high metal removal rates. The method uses a related polishing composition. Components in the composition include poly (alkyleneimines) such as polyethyleneimine, abrasives, acids, and oxidants such as per-compounds. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190132951-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160132923-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200010135-A |
| priorityDate |
2010-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |