http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110039452-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-035 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-035 |
| filingDate | 2009-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_debab755bbe7671f2fbe7142d1934cbe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c623082c8fe2851a83fa3d640587463a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16d95b96439a6026d232a295bb221845 |
| publicationDate | 2011-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20110039452-A |
| titleOfInvention | Flame-retardant photocurable resin composition, its dry film, and hardened | cured material, and printed wiring board using these |
| abstract | The present invention is a non-halogen composition, has a low environmental load and is excellent in flame retardancy and capable of forming a cured film rich in flexibility. Provided is a printed wiring board on which a flame-retardant cured film is formed. A flame-retardant photocurable resin composition contains (A) organic solvent soluble phosphorus element containing polyester, (B) carboxyl group-containing resin, and (C) photoinitiator. Preferably, the carboxyl group-containing resin (B) is a carboxyl group-containing polyurethane resin. More preferably, it further contains (D) a photopolymerizable monomer, or further contains (E) thermosetting resin. Such a flame-retardant photocurable resin composition, especially the flame-retardant photocurable and thermosetting resin composition containing a thermosetting resin (E), can be used suitably as a soldering resist. |
| priorityDate | 2008-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 318.