http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070108919-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d04736b0b882a4f5a1e0e0e4cd8cbb |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 2006-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7d075f7e486a5d785fdf5128a0c3450 |
| publicationDate | 2007-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20070108919-A |
| titleOfInvention | Flame Retardant Compositions for Solder Resists and Cured Products |
| abstract | Provided are flame retardant compositions for solder resists that are halogen free, have excellent flame resistance and flexibility, and exhibit excellent heat resistance, moisture resistance and high temperature reliability. The flame retardant composition for soldering resists according to the present invention is obtained by the reaction of (A) (a) an epoxy resin having two or more epoxy groups in a molecule, (b) an unsaturated group-containing monocarboxylic acid and (c) a polybasic acid anhydride ( A1) Alkali-soluble resin containing 1 or more types of carboxyl group-containing epoxy (meth) acrylate or (A2) carboxyl group-containing urethane (meth) acrylate, (B) A compound which has ethylenically unsaturated group in a molecule, (C) Photoinitiator , (D) phosphorus-containing epoxy resin having a specific structure, and (E) hydrated metal compound. The composition of this invention can be used suitably as a soldering resist or a coverlay film for FPC. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9880467-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110039452-A |
| priorityDate | 2005-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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