| abstract |
According to the present invention, in the case of forming a PI, the degree of freedom of the package to be combined is small, the constraints on the pattern design are small, and the connection between the upper package and the lower package can be performed at a high density, further reducing warpage and high reliability. An object of the present invention is to provide a package substrate for mounting a semiconductor device and a method of manufacturing the same. The present invention provides a via-attached cavity layer having an opening and a through hole, a base layer laminated on the cavity layer by the adhesive, a cavity portion formed by the opening, and a bottom having a bottom formed by the through hole. A semiconductor package substrate having a semiconductor substrate, wherein the adhesive is an elastomer material, the inner wall of the via having the bottom is covered with a metal, and a conductive resin is filled thereon, and the manufacturing method is a semiconductor device mounting package substrate. |