http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20100102073-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0483
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
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filingDate 2010-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44a66292324b5ef3df3261f009c8854b
publicationDate 2010-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20100102073-A
titleOfInvention Conductive interconnect
abstract BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a conductive interconnect made to conduct electricity only in the vertical direction and having a buffering performance. The present invention is an insulator formed with a plurality of filling holes penetrating in the vertical direction; And a conductive material having conductivity and filled in the filling holes, thereby providing a conductive interconnect, characterized in that it conducts electricity in a vertical direction. According to the present invention, it is possible to prevent the terminal of the inspection circuit board for testing a defect of the electrical device from being worn out and to lose its conductivity, and simplify the electrical connection structure of the electrical elements mounted on the printed circuit board. There is an effect that the thickness of the component for electrically connecting the electrical elements can be reduced.
priorityDate 2009-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 28.