http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0864729-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76 |
| filingDate | 1994-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f38ad097ca37f52e82a6729139f9aa1a |
| publicationDate | 1996-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0864729-A |
| titleOfInvention | Socket for semiconductor device |
| abstract | (57) [Abstract] [Purpose] To provide a socket for a semiconductor device that stabilizes the operation during characteristic measurement without being affected by the inductance component of the internal lead. [Structure] An IC socket 1 includes a plate-shaped insulator 2 made of an elastic material such as a rubber sheet, and a plurality of through-holes 3. And a plurality of conductive balls 4 are filled in each through hole 3. As the conductive sphere 4, for example, an elastic sphere such as silicone rubber formed by plating, vapor deposition or the like with various conductors such as solder, tin or nickel is used. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20100102073-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016035441-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160134311-A |
| priorityDate | 1994-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.