http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20100067213-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aafe0172ffd94d3486c518b0709bb2b3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2008-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b1768165db64a8167fc56dca27f9fbb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_003f884877103a5656a7911a6619e490 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97d7d8412171a81366626ff0f2105a83 |
| publicationDate | 2010-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20100067213-A |
| titleOfInvention | Epoxy resin composition for sealing semiconductor device and semiconductor device using same |
| abstract | The present invention relates to an epoxy resin composition for sealing semiconductor elements, and more particularly, to an epoxy resin composition comprising an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and an adhesion improving agent, wherein the adhesion improving agent is represented by Chemical Formula 1 The present invention relates to an epoxy resin composition for sealing a semiconductor device comprising using a triazole compound VII and a tetrazole compound represented by the formula (2).n n n n n n n The epoxy resin composition of the present invention improves the adhesion of the pre-plated frame and the silver plated pad surface to increase the reliability of the semiconductor device and at the same time separate halogen, antimony trioxide, etc. Excellent flame retardancy is secured even without using a flame retardant, which is useful for manufacturing a resin-sealed semiconductor device. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101340545-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108485185-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108384195-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108384195-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108485185-A |
| priorityDate | 2008-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 108.