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filingDate 2018-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-108384195-B
titleOfInvention A kind of epoxy resin composition with high adhesion to nickel and its application
abstract The invention relates to an epoxy resin composition with high adhesion to nickel and its application. A kind of epoxy resin composition with high adhesion to nickel, the coupling agent used is 2-methyl-5-amino-2H-tetrazole, 2-ethyl-2H-tetrazole-5-amine, 1-Ethyl-1H-tetrazole-5-amine, 2-prop-2-alkenyltetrazole-5-amine, 5-aminotetrazole, and 3-[2-hydrocarbyl-3-(2H-tetrazole One of -5-amino)-propoxy]-propyltrimethoxysilane or a mixture of several of them in any proportion. Application: used as a packaging material for the packaging of components. The epoxy resin composition with high adhesion to nickel of the present invention produces stronger adhesion to the nickel surface; it has excellent flame retardancy, flow formability and curability. Good operability; it has excellent adhesion, reflow resistance, electrical stability and moisture resistance when used as a packaging material for packaging components, and is suitable for various component packaging.
priorityDate 2018-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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