http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090104659-A

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-2414
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0483
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0466
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
filingDate 2009-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2009-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20090104659-A
titleOfInvention Socket for semiconductor chip inspection
abstract The present invention relates to a socket for inspecting a semiconductor chip, and to provide a socket for inspecting a semiconductor chip adopting a structure that is easy to manufacture while improving its lifespan, and a flat plate-shaped support plate having a fastening hole formed at a center thereof in the vertical direction. A plurality of silicon portions coupled to the fastening holes, the silicon portions having protrusions protruding upwards, and a plurality of conductive silicon portions formed by vertically disposing a metal ball on the protrusions, and seated on top of the conductive silicon portions to contact solder balls of a semiconductor chip. A through hole is formed at a position corresponding to the plunger and the plunger, and a receiving portion is formed at the lower portion to receive the protrusion, and is coupled to the silicon portion and comprises a cap fixing the plunger. Plates with probe protrusions in contact with solder balls on semiconductor chips Inexpensive coupling prevents abrasion of the conductive silicon portion, improving the life of the inspection socket, and adopting a simple structure in which the cap formed at the lower portion of the accommodating portion is bonded using the silicone portion and an adhesive to facilitate the manufacture of the inspection socket. Has the advantage.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101353481-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101153167-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101689249-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8228086-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101138963-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014088131-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101483757-B1
priorityDate 2008-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
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Total number of triples: 25.