| abstract |
This invention aims at providing the resin composition which expresses high heat resistance and low dielectric constant, its varnish, a resin film, and the semiconductor device using the same. This invention solved the said subject by the resin composition containing the compound and crosslinking agent which have a structure represented by General formula (1).n n n n n n n n [In formula (1), R < 0> is a structure represented by a single bond or general formula (2). R 1 to R 8 represent any one of an organic group having 1 to 10 carbon atoms, a hydroxyl group and a carboxyl group other than hydrogen, a group having an alicyclic structure, and a group having the alicyclic structure. X represents any of -O-, -NHCO-, -CONH-, -COO-, and -OCO-. In Formula (2), Ar represents an aromatic group, Y represents a single bond, -O-, -S-, -OCO-, and -COO-. q is an integer of 1 or more. R 9 represents hydrogen or an organic group having 1 or more carbon atoms, and when q is an integer of 2 or more, R 9 may be the same as or different from each other. When R 0 is a single bond, at least one of R 1 to R 8 is a group having the alicyclic structure. Moreover, when R < 0> is a structure represented by General formula (2), at least 1 of R < 1> -R < 9> is group which has alicyclic structure. * And ** represent sites that bind with other chemical structures.] |