http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070110451-A

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filingDate 2000-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a56d3b61ddb517d7a336eceb0ffdaf4
publicationDate 2007-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20070110451-A
titleOfInvention Continuous chemical vapor deposition
abstract The present invention provides for continuous chemical vapor deposition by lines 18 which introduce gas into the reaction chamber 2 or 3 through the reaction chamber 2 or 3, pump 38 and valves 20 and 22 operated at low pressure. to provide. The first reactants 28, 29 form a monolayer to be coated on the paat, while the second reactant passes through the radical generator 14, 16 or 44, and the radical generator unites the second reactant. Partially decomposes or activates into gaseous radicals before reaching the layer. The second reactant is not necessary for monolayer formation but is used to react with the monolayer. The excess second reactant and reaction product are discharged or removed in the reaction chamber 2 or 3 by completion of the process cycle. For example, the removal is performed by simply stopping the power of the radical generator and the flow of the second reactant into the chamber continues. This process cycle can be repeated until it has grown to the thickness of the desired film.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140008751-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130113783-A
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