| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2312-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2891
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2809
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-28 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-603 |
| filingDate |
2007-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5625cb555ca9c1142441c4c237bd7267
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48a4dcb99baabc746c665fdbef6b5e6f |
| publicationDate |
2007-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20070109910-A |
| titleOfInvention |
Pressure-sensitive adhesive sheet for semiconductor wafer or semiconductor substrate processing |
| abstract |
The present invention relates to a pressure-sensitive adhesive sheet for semiconductor wafer or semiconductor substrate processing comprising a pressure-sensitive adhesive layer polymerizable and curable by a base material and an energy ray and disposed on the surface of the base material, wherein the pressure-sensitive adhesive layer is a base Polymers, energy-ray polymerizable carbon-carbon double bonds and multifunctional acrylate oligomers having a molecular weight of 1000 to 2500 and energy-ray polymerizable carbon-carbon double bonds and multifunctional acrylate compounds having a molecular weight of 200 to 700 Include. The pressure-sensitive adhesive sheet of the present invention is excellent in tracking properties for minute non-uniformity of about 0.4 to 40 μm depth, such as a mark printed by laser irradiation, shows sufficient adhesion, and retains adhesive after the purpose of adhesion is achieved. It can be peeled off without generation of water.n n n Semiconductor wafer, semiconductor substrate, pressure-sensitive adhesive sheet |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101370812-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150047535-A |
| priorityDate |
2006-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |