http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070095210-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
filingDate 2007-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b49110e6d3e24d5633defa3b01cd29df
publicationDate 2007-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20070095210-A
titleOfInvention Plasma processing apparatus and plasma processing method
abstract To improve the durability of the parts, members and parts exposed to the plasma atmosphere in the chamber used for plasma etching in the corrosive gas atmosphere, and the plasma erosion resistance of the film formed on the surface of the member in the corrosive gas atmosphere. The present invention proposes a plasma processing apparatus and a plasma processing method using the same, which can prevent the generation of particles of corrosion products even under high plasma output. Processed by plasma In the plasma processing apparatus, the surface exposed to the plasma generating atmosphere of the chamber, the surface of the arrangement member or component in the chamber is formed of at least a porous layer made of a metal oxide and the metal oxide formed on the porous layer. By secondary recrystallization layer It is covered.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110005661-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140051280-A
priorityDate 2006-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 24.