| abstract |
The present invention includes the steps of preparing abrasive particles, ultrapure water and dispersant, milling the mixture of abrasive particles, ultrapure water and dispersant, and stabilizing the slurry by aging the mixture, wherein the abrasive particles are subjected to the aging process. It provides a method for producing a polishing slurry, characterized in that controlling the average particle size of the 80 to 300nm and the polishing slurry characterized in that it is produced accordingly.n n n In the present invention, by introducing a aging step in the production of the polishing slurry, it is possible to prevent the generation of large particles in the slurry and to enhance dispersion stability. Accordingly, there is an effect that can reduce scratches and residual particles that can cause fatal defects in the device during the CMP process. |