| abstract |
The transition layer 38 is disposed on the die pad 22 of the IC chip 20 and embedded in the multilayer printed circuit board 10.n n n For this reason, it is possible to make electrical connection with the IC chip 20 and the multilayer printed wiring board 10, without using a lead component or sealing resin.n n n Alternatively, by providing a copper transition layer 38 on the aluminum pad 24, it is possible to prevent resin residue on the pad 24, and to connect the die pad 24 and the via hole 60. Or improve reliability.n n n n Semiconductor device, multilayer printed circuit board |